Welcome to netCOMPONENTS! netCOMPONENTS is a market leader in sourcing services for the worldwide electronic components industry. netCOMPONENTS is the world's premier destination for the sourcing and procurement of electronic components, connecting members (buyers) and suppliers (sellers) in a direct and vendor-neutral environment!

Stock/Availability for: MIC58P01BV

Find stocking distributors and other suppliers of MIC58P01BV using netCOMPONENTS. If you are not already a netCOMPONENTS member, request a free trial membership today to search the netCOMPONENTS database of 50 million+ electronic component line items and contact MIC58P01BV suppliers.

Register Today

  • Search 900 Billion+ Electronic Components
  • 3,000+ Suppliers
  • Launched in 1997
Request a Free Trial Membership

Statistics

Total Quantity
50,708
Line Items
26
Suppliers listing this part
26
Countries/regions where listing suppliers exist
7
Most Recent Upload
1/28/2026

Sponsored Live Part Search

Part Number: MIC58P01BV

Part Number Country/Region Suppliers Line Items Total Qty
MIC58P01BV US 8 8 3,046
MIC58P01BV CN 7 7 26,454
MIC58P01BV DE 5 5 13,391
MIC58P01BV JP 3 3 4,408
MIC58P01BV HK 1 1 2,100
MIC58P01BV AE 1 1 1,140
MIC58P01BV TW 1 1 169

Other Parts

Part Number Countries/Regions Suppliers Line Items Total Qty
MIC58P01YWM 9 36 37 267,069
MIC58P01YV 9 24 24 191,906
MIC58P01YWM-TR 6 14 14 173,383
MIC58P01BN 6 14 18 14,954
MIC58P01YN 7 10 10 74,953
MIC58P01YV-TR 3 10 10 130,253
MIC58P01BWM 4 8 8 9,794
MIC58P01BV TR 4 5 5 44,262
MIC58P01BWM-TR 2 2 2 9,178
MIC58P01BW 1 1 1 24

Possible Component Manufacturers*

Micro Computer Specialists (MCSI Embedded) (ICP America)
TelCom Semiconductor (Microchip)
PowerDsine (Microsemi)
Microtherm (MIC)
Intermetall (ITT Intermetall) (Micronas) (TDK-Micronas)
Standard Microsystems Corp (Toyo Microsystems) (Microchip)

* This symbol ( ) will appear next to the manufacturer if a datasheet is available for the part. Registered members can click on the datasheet icon to locate the datasheet for the part.


Page Created: 1/28/2026